Effects of Copper Foil Type and Surface Preparation on Fine...

Effects of Copper Foil Type and Surface Preparation on Fine Line Image Transfer in Primary Imaging of Printed Wiring Boards

Mc Gregor, D. R., Adams-Melvin, B. L., Dietz, K. H.
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Volume:
74
Language:
english
Journal:
Transactions of the IMF
DOI:
10.1080/00202967.1996.11871111
Date:
January, 1996
File:
PDF, 8.55 MB
english, 1996
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