Process Parameter Optimization of Solder Paste Deposition...

IEEE Transactions on Components Packaging and Manufacturing Technology 2018 / 3 Vol. 8; Iss. 3

Process Parameter Optimization of Solder Paste Deposition for SoC Using Taguchi–Grey and Entropy Approach

Liu, Zhiwen, Ming, Xinguo, Qu, Yuanju, Li, Xiuzhen
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Volume:
8
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2017.2788007
Date:
March, 2018
File:
PDF, 2.84 MB
english, 2018
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