Fast Electromigration Stress Evolution Analysis for...

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IEEE Transactions on Very Large Scale Integration (VLSI) Systems 2018

Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method

Cook, Chase, Sun, Zeyu, Demircan, Ertugrul, Shroff, Mehul D., Tan, Sheldon X.-D.
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Year:
2018
Language:
english
Journal:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
DOI:
10.1109/TVLSI.2018.2800707
File:
PDF, 2.46 MB
english, 2018
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