Experimental Study of Void Formation in High-Lead Solder...

Journal of Electronic Packaging 2005 Vol. 127; Iss. 2

Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies

Wang, Daijiao, Panton, Ronald L.
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Volume:
127
Year:
2005
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1876472
File:
PDF, 911 KB
english, 2005
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