[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Convective Performance of Package Based Single Phase Microchannel Heat Exchanger
Chang, Je-Young, Prasher, Ravi, Chau, David, Myers, Alan, Dirner, John, Prstic, Suzana, He, DongmingYear:
2005
Language:
english
DOI:
10.1115/IPACK2005-73126
File:
PDF, 798 KB
english, 2005