Fast Electromigration Immortality Analysis for Multi-Segment Copper Interconnect Wires
Sun, Zeyu, Demircan, Ertugrul, Shroff, Mehul D., Cook, Chase, Tan, Sheldon X.-D.Year:
2018
Language:
english
Journal:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
DOI:
10.1109/TCAD.2018.2801221
File:
PDF, 1.02 MB
english, 2018
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