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[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - An Evaluation of Auxiliary Part Configuration in the Micro Flow Sensor by Using Micro PIV
Suzuki, Daichi, Nagumo, Takashi, Honami, Shinji, Kamiunten, ShojiYear:
2005
Language:
english
DOI:
10.1115/IPACK2005-73194
File:
PDF, 305 KB
english, 2005