[ASME ASME 2003 International Mechanical Engineering Congress and Exposition - Washington, DC, USA (November 15–21, 2003)] Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology - Nanoscale Modeling and Simulation of Interfacial Bonding of Single-Walled Nanotube Reinforced Composites
Gou, Jihua, Jiang, Shunliang, Minaie, Bob, Liang, Zhiyong, Zhang, Chuck, Wang, BenVolume:
2003
Year:
2003
Language:
english
DOI:
10.1115/imece2003-41138
File:
PDF, 516 KB
english, 2003