Novel Method of Aluminum to Copper Bonding by Cold Spray

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Journal of Thermal Spray Technology 2018 / 3

Novel Method of Aluminum to Copper Bonding by Cold Spray

Fu, Si-Lin, Li, Cheng-Xin, Wei, Ying-Kang, Luo, Xiao-Tao, Yang, Guan-Jun, Li, Chang-Jiu, Li, Jing-Long
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Language:
english
Journal:
Journal of Thermal Spray Technology
DOI:
10.1007/s11666-018-0707-1
Date:
March, 2018
File:
PDF, 7.62 MB
english, 2018
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