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[IEEE 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Haining (2017.12.14-2017.12.16)] 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - A package-level driver amplifier with 134% relative bandwidth
Chen, Dong, Xing, Zhao, Chen, Zhilin, Zhao, Chenxi, Liu, Huihua, Kang, KaiYear:
2017
Language:
english
DOI:
10.1109/EDAPS.2017.8276978
File:
PDF, 934 KB
english, 2017