![](/img/cover-not-exists.png)
Novel High-Performance Bondwire Chip-to-Chip Interconnections for Applications Up to 220 GHz
Testa, Paolo Valerio, Carta, Corrado, Ellinger, FrankVolume:
28
Language:
english
Journal:
IEEE Microwave and Wireless Components Letters
DOI:
10.1109/LMWC.2018.2792695
Date:
February, 2018
File:
PDF, 1.71 MB
english, 2018