[IEEE 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Burlingame, CA, USA (2017.10.16-2017.10.19)] 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - 1μm Pitch direct hybrid bonding with
Jouve, A., Balan, V., Bresson, N., Euvrard-Colnat, C., Fournel, F., Exbrayat, Y., Mauguen, G., Sater, M. Abdel, Beitia, C., Arnaud, L., Cheramy, S., Lhostis, S., Farcy, A., Guillaumet, S., Mermoz, S.Year:
2017
Language:
english
DOI:
10.1109/S3S.2017.8309213
File:
PDF, 170 KB
english, 2017