[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Reliable Cu-Cu Thermocompression Bonding by Low Temperature Sintered Cu Nanowires
Du, Li, Shi, Tielin, Tang, Zirong, Liao, GuanglanYear:
2017
Language:
english
DOI:
10.1109/ectc.2017.33
File:
PDF, 1.80 MB
english, 2017