[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Creep Properties and Microstructure of the Sn-Ag-Cu-Ni-Ge Lead-Free Solder Alloy
Hidaka, Noboru, Nagano, Megumi, Shimoda, Masayoshi, Watanabe, Hirohiko, Ono, MasahiroYear:
2005
Language:
english
DOI:
10.1115/IPACK2005-73148
File:
PDF, 965 KB
english, 2005