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Enhanced Ti0.84Ta0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si(001) wafers and Cu overlayers
Mühlbacher, Marlene, Greczynski, Grzegorz, Sartory, Bernhard, Schalk, Nina, Lu, Jun, Petrov, Ivan, Greene, J. E., Hultman, Lars, Mitterer, ChristianVolume:
8
Language:
english
Journal:
Scientific Reports
DOI:
10.1038/s41598-018-23782-9
Date:
December, 2018
File:
PDF, 2.85 MB
english, 2018