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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Study on the microstructure of Si/solder/Si joint based on Al/Ni self-propagating exothermic reaction
Hu, Sicong, Zhou, Zheng, Liu, Hui, Zhu, Wenbo, Wu, FengshunYear:
2017
Language:
english
DOI:
10.1109/icept.2017.8046602
File:
PDF, 957 KB
english, 2017