[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Adhesion Strength at High Temperatures Affected by Moisture for Die-Attach Materials of Integrated Circuit Packages
Tanaka, Hiroyuki, Numata, TakashiYear:
2005
Language:
english
DOI:
10.1115/IPACK2005-73139
File:
PDF, 325 KB
english, 2005