In Situ Evaluation of Residual Stresses in an Organic...

Journal of Electronic Packaging 1998 Vol. 120; Iss. 3

In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive

Voloshin, A. S., Tsao, P.-H., Pearson, R. A.
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Volume:
120
Year:
1998
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792639
File:
PDF, 660 KB
english, 1998
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