[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - DDRII Memory Packages Electrical Performance Comparison of COSBGA, TFBGA, and Standard TSOPII
Hsieh, Bryan, Chiang, Kevin, Wang, Y. P., Hsiao, C. S.Year:
2005
Language:
english
DOI:
10.1115/IPACK2005-73200
File:
PDF, 1.95 MB
english, 2005