[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Integration of RF Inductors and Baluns in Multilayer Organic Substrates
Kamgaing, Telesphor, Lee, Chee Hoo, Hwang, Kyu-Pyung, Zeng, Xiang Yin, He, Jiangqi, Hsu, Rockwell, Min, Yongki, Ihm, Jae-YongYear:
2005
Language:
english
DOI:
10.1115/IPACK2005-73316
File:
PDF, 339 KB
english, 2005