[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Thermodynamic Design of Compact Thermal Compressor for Sorption Assisted Cryogenic Cooling of Electronics
Suman, Shivesh K., Fedorov, Andrei G., Joshi, Yogendra K.Year:
2005
Language:
english
DOI:
10.1115/IPACK2005-73452
File:
PDF, 351 KB
english, 2005