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Evolution of the Thermal Conductivity of Sintered Silver Joints with their Porosity Predicted by the Finite Element Analysis of Real 3D Microstructures
Signor, L., Kumar, P., Tressou, B., Nadot-Martin, C., Miranda-Ordonez, José, Carr, J., Joulain, K., Milhet, X.Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-018-6253-2
Date:
March, 2018
File:
PDF, 3.30 MB
english, 2018