[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Research on the structural reliability of the ceramic package for packaging SIP
Yang, Zhen-tao, Bo Peng,, Ling Gao,Year:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046509
File:
PDF, 803 KB
english, 2017