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[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Wafer-Level Vacuum-Packaged Piezoelectric Energy Harvesters Utilizing Two-Step Three-Wafer Bonding
Wang, Nan, Siow, Li Yan, Wong, Lionel You Liang, Sun, Chengliang, Ji, Hongmiao, Made, Darmayuda I, Chang, Peter, Zhang, Qingxin, Gu, YuandongYear:
2017
Language:
english
DOI:
10.1109/ECTC.2017.108
File:
PDF, 532 KB
english, 2017