![](/img/cover-not-exists.png)
[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Multi-chip plastic package technology with new substrate
Zhang, Rongzhen, Zhu, Yuan, Liao, Xiaoping, Gao, NayanYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046432
File:
PDF, 20.25 MB
english, 2017