[IEEE 2017 18th International Conference on Electronic...

  • Main
  • [IEEE 2017 18th International...

[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Simulation analysis and optimization of pin failure of a CSOP-packaged devices

Zhu, Yuan, Gao, Nayan, Zhang, Rongzhen
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2017
Language:
english
DOI:
10.1109/icept.2017.8046475
File:
PDF, 1003 KB
english, 2017
Conversion to is in progress
Conversion to is failed