![](/img/cover-not-exists.png)
[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Simulation analysis and optimization of pin failure of a CSOP-packaged devices
Zhu, Yuan, Gao, Nayan, Zhang, RongzhenYear:
2017
Language:
english
DOI:
10.1109/icept.2017.8046475
File:
PDF, 1003 KB
english, 2017