A Compact Approach to On-Chip Interconnect Heat Conduction...

Journal of Electronic Packaging 2008 Vol. 130; Iss. 3

A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method

Gurrum, Siva P., Joshi, Yogendra K., King, William P., Ramakrishna, Koneru, Gall, Martin
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
130
Year:
2008
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2957318
File:
PDF, 808 KB
english, 2008
Conversion to is in progress
Conversion to is failed