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Glass-Copper anodic bonding through activated Sn-0.6Al solder
Feng, Guangjie, Li, Zhuoran, Xu, Xiaolong, Shen, Zhongke, Yang, YongVolume:
254
Language:
english
Journal:
Journal of Materials Processing Technology
DOI:
10.1016/j.jmatprotec.2017.11.038
Date:
April, 2018
File:
PDF, 791 KB
english, 2018