Modeling and Analysis of TSV Noise Coupling Effects on RF...

  • Main
  • 2018
  • Modeling and Analysis of TSV Noise Coupling Effects on RF...
IEEE Transactions on Electromagnetic Compatibility 2018

Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC

Lim, Jaemin, Cho, Jonghyun, Jung, Daniel H., Kim, Jonghoon J., Choi, Sumin, Kim, Dong-Hyun, Lee, Manho, Kim, Joungho
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2018
Language:
english
Journal:
IEEE Transactions on Electromagnetic Compatibility
DOI:
10.1109/TEMC.2018.2800120
File:
PDF, 1.14 MB
english, 2018
Conversion to is in progress
Conversion to is failed