A New Physical Insight for the 3-D-Layout-Induced...

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IEEE Transactions on Electron Devices 2018

A New Physical Insight for the 3-D-Layout-Induced Cylindrical Breakdown in Lateral Power Devices on SOI Substrate

Zhang, Jun, Guo, Yufeng, Pan, David Z., Yang, Kemeng, Lian, Xiaojuan, Yao, Jiafei, Li, Man
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Year:
2018
Language:
english
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/TED.2018.2810325
File:
PDF, 1.74 MB
english, 2018
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