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Grain-Boundary Resistance in Copper Interconnects: From an Atomistic Model to a Neural Network
Valencia, Daniel, Wilson, Evan, Jiang, Zhengping, Valencia-Zapata, Gustavo A., Wang, Kuang-Chung, Klimeck, Gerhard, Povolotskyi, MichaelVolume:
9
Language:
english
Journal:
Physical Review Applied
DOI:
10.1103/PhysRevApplied.9.044005
Date:
April, 2018
File:
PDF, 5.49 MB
english, 2018