![](/img/cover-not-exists.png)
[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration
Kumar Panigrahi, Asisa, Bonam, Satish, Ghosh, Tamal, Krishna Vanjari, Siva Rama, Govind Singh, ShivYear:
2016
Language:
english
DOI:
10.1109/3dic.2016.7970019
File:
PDF, 1.51 MB
english, 2016