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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Investigation on thermal characteristics and fabrication of DUV-LEDs using copper filled thermal hole
Xu, Linlin, Liang, Renli, Long, Hanling, Dai, Jiangnan, Chen, ChangqingYear:
2017
Language:
english
DOI:
10.1109/ICEPT.2017.8046618
File:
PDF, 695 KB
english, 2017