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IEEE Transactions on Components Packaging and Manufacturing Technology 2018

IC Solder Joint Inspection Based on an Adaptive-Template Method

Ye, Qian, Cai, Nian, Li, Jiaming, Li, Feiyang, Wang, Han, Chen, Xindu
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Year:
2018
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2018.2812815
File:
PDF, 1.34 MB
english, 2018
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