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[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Investigation of Packaging Effect of Silicon-Based Piezoresistive Pressure Sensor
Chu, Chen-Hing, Chou, Tsung-Lin, Lin, Chun-Te, Chiang, Kuo-NingVolume:
2006
Year:
2006
Language:
english
DOI:
10.1115/imece2006-14208
File:
PDF, 446 KB
english, 2006