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Adhesion and failure analysis of metal-polymer interface in flexible printed circuits boards
Park, Sanghee, Kim, Ye Chan, Choi, Kisuk, Chae, Heeyop, Suhr, Jonghwan, Nam, Jae-DoVolume:
71
Language:
english
Journal:
Journal of the Korean Physical Society
DOI:
10.3938/jkps.71.1019
Date:
December, 2017
File:
PDF, 3.02 MB
english, 2017