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[IEEE 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2016.7.18-2016.7.21)] 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Localization techniques for finding embedded defects in stacked die package
Yeoh, Lai-Seng, Chong, Kok-Cheng, Li, SusanYear:
2016
DOI:
10.1109/ipfa.2016.7564239
File:
PDF, 842 KB
2016