3D IC and RF SiPs (Advanced Stacking and Planar Solutions for 5G Mobility) || A. Failure Mechanisms and Failure Analysis
Hwang, Lih-Tyng, Horng, Tzyy-Sheng JasonVolume:
10.1002/97
Year:
2018
Language:
english
DOI:
10.1002/9781119289654.app1
File:
PDF, 234 KB
english, 2018