3D IC and RF SiPs (Advanced Stacking and Planar Solutions for 5G Mobility) || Electrical Design for 5G Hardware-Digital Focus
Hwang, Lih-Tyng, Horng, Tzyy-Sheng JasonVolume:
10.1002/97
Year:
2018
Language:
english
DOI:
10.1002/9781119289654.ch5
File:
PDF, 1.46 MB
english, 2018