[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Effect of multilayer films and current on IMC formation in solder joints
Liu, Wei, Nie, Yuzhuo, Wang, Chunqing, Tian, YanhongYear:
2017
Language:
english
DOI:
10.1109/icept.2017.8046733
File:
PDF, 1.34 MB
english, 2017