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Mechanical/Structural Properties of the Key Thin Film Materials Ag, Cu, & Ni for Electronics Applications
Mohammed, Y., Josell, D., Baumgart, H., Elmustafa, A. A.Volume:
75
Language:
english
Journal:
ECS Transactions
DOI:
10.1149/07505.0087ecst
Date:
September, 2016
File:
PDF, 292 KB
english, 2016