The effect of pressure and orientation on Cu-Cu 3 Sn...

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Materials & Design 2018 / 4

The effect of pressure and orientation on Cu-Cu 3 Sn interface reliability under isothermal ageing and monotonic traction via molecular dynamics investigation

Liang, Lihua, Zhang, Jicheng, Xu, Yangjian, Zhang, Yuanxiang, Wang, Wei, Yang, Jian
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Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2018.04.004
Date:
April, 2018
File:
PDF, 1.73 MB
english, 2018
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