Thermal characterization of full-scale PCM products and...

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Applied Thermal Engineering 2018 / 4

Thermal characterization of full-scale PCM products and numerical simulations, including hysteresis, to evaluate energy impacts in an envelope application

Biswas, Kaushik, Shukla, Yash, Desjarlais, Andre, Rawal, Rajan
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Language:
english
Journal:
Applied Thermal Engineering
DOI:
10.1016/j.applthermaleng.2018.04.090
Date:
April, 2018
File:
PDF, 2.27 MB
english, 2018
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