Effect of thermal cycles on interface and mechanical...

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Journal of Materials Science: Materials in Electronics 2018 / 4

Effect of thermal cycles on interface and mechanical property of low-Ag Sn1.0Ag0.5Cu(nano-Al)/Cu solder joints

Sun, Lei, Chen, Ming-he, Wei, Chun-chun, Zhang, Liang, Yang, Fan
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Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-018-9014-3
Date:
April, 2018
File:
PDF, 1.86 MB
english, 2018
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