Behavior of stress generated in semiconductor chips with high-temperature joints: Influence of mechanical properties of joint materials
Ito, H., Kuwahara, M., Ohta, R., Usui, M.Volume:
123
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.5005572
Date:
April, 2018
File:
PDF, 789 KB
english, 2018