Electronic speckle pattern interferometry analysis of...

Experimental Mechanics 2001 / 03 Vol. 41; Iss. 1

Electronic speckle pattern interferometry analysis of tensile tests of semihard copper sheets

C. Vial-Edwards, I. Lira, A. Martinez, M. Münzenmayer
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Volume:
41
Language:
english
Pages:
5
DOI:
10.1007/bf02323105
Date:
March, 2001
File:
PDF, 654 KB
english, 2001
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