![](/img/cover-not-exists.png)
Novel Pressure-sensitive Bonding Tape in the Three-dimensional Chip Stacking
EBE, Kazuyoshi, SENOO, Hideo, YAMAZAKI, OsamuVolume:
42
Year:
2006
Journal:
Journal of The Adhesion Society of Japan
DOI:
10.11618/adhesion.42.280
File:
PDF, 2.28 MB
2006