Novel Pressure-sensitive Bonding Tape in the...

Novel Pressure-sensitive Bonding Tape in the Three-dimensional Chip Stacking

EBE, Kazuyoshi, SENOO, Hideo, YAMAZAKI, Osamu
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Volume:
42
Year:
2006
Journal:
Journal of The Adhesion Society of Japan
DOI:
10.11618/adhesion.42.280
File:
PDF, 2.28 MB
2006
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