Stress Analysis in Silicon Substrates during Thermal...

JSME international journal. Ser. A, Mechanics and material engineering 1996 Vol. 39; Iss. 1

Stress Analysis in Silicon Substrates during Thermal Oxidation

OHTA, Hiroyuki, SAITO, Naoto, MIURA, Hideo, OKAMOTO, Noriaki
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Volume:
39
Year:
1996
Journal:
JSME international journal. Ser. A, Mechanics and material engineering
DOI:
10.1299/jsmea1993.39.1_49
File:
PDF, 733 KB
1996
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