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Influence of Wafer Edge Profile on STI-CMP Process Performance : Examination Based on Surface Pressure of Wafer Calculated by FEM Analysis(Machine Elements, Design and Manufacturing)
FUKUDA, Akira, FUKUDA, Tetsuo, HIYAMA, Hirokuni, TSUJIMURA, Manabu, DOI, Toshiro, KUROKAWA, Syuhei, OHNISHI, OsamuVolume:
76
Year:
2010
DOI:
10.1299/kikaic.76.1610
File:
PDF, 973 KB
2010