Simple 3D Measurement of Through-Silicon Vias by Analyzing...

Simple 3D Measurement of Through-Silicon Vias by Analyzing a Projection Image of Nano-focus X-ray Microscope

UMEHARA, Yasutoshi, MORONUKI, Nobuyuki
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Volume:
82
Year:
2016
Journal:
Journal of the Japan Society for Precision Engineering
DOI:
10.2493/jjspe.82.901
File:
PDF, 2.67 MB
2016
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